{"id":672,"date":"2025-01-16T01:19:38","date_gmt":"2025-01-15T17:19:38","guid":{"rendered":"https:\/\/rsjpcba.com\/?page_id=672"},"modified":"2025-03-03T14:28:58","modified_gmt":"2025-03-03T06:28:58","slug":"process-capabilities","status":"publish","type":"page","link":"https:\/\/rsjpcba.com\/es\/process-capabilities\/","title":{"rendered":"capacidad de fabricaci\u00f3n"},"content":{"rendered":"
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capacidad de fabricaci\u00f3n<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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Printed board technology capabilities<\/span><\/div>\r\n<\/div>\r\n\r\n<\/span>\r\n<\/div>\r\n<\/div>\r\n
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sports event<\/span><\/span><\/span><\/td>parameters<\/span><\/td>clarification<\/span><\/td><\/tr>
Maximum number of layers<\/span><\/td>36 floors<\/span><\/td>
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Minimum Line Width\uff08mm\uff09<\/span><\/td>2.5mil<\/span><\/td>
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Minimum Line Distance\uff08mm\uff09<\/span><\/td>2.5mil<\/span><\/td>
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Minimum weld ring\uff08mm\uff09<\/span><\/td>via\uff1a0.08
<\/span><\/td>		Distance from hole edge to outermost edge of weld ring
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device hole\uff1a0.18
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Minimum Hole Diameter
<\/span><\/td>		plate thickness <   2.0mm     0.15mm
<\/span><\/td>		Refers to the finished hole
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plate thickness \u2265   2.0mm    pore size ratio \u2264 12
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Maximum plate thickness
<\/span><\/td>		Single and double sided panels 3.2 mm
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multilayer 6.0 mm <\/span><\/td><\/tr>
maximum size<\/span><\/td>FR4 plate
<\/span><\/td>		1100 * 600 mm
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microwave plate   
<\/span><\/td>		550 * 450 mm
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Plate Type
<\/span><\/td>		FR4\uff08Lianmao, Sangyi, Taiyo, Panasonic\uff09\uff0cAluminum-based, Copper-based\u3001Polyimide\u3001Polytetrafluoroethylene, Rogers series, Wangling series.
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Special process
<\/span><\/td>		Blind embedded holes, impedance, holes in tray, resin plug holes, copper paste plug holes, plate edge metallization, half holes, thick copper, gold wire bonding, crimp holes, back drilling, gold fingers, embedded impedance, embedded capacitance, blind slots, controlled depth holes, steps, high frequency mixing and pressing, microstrip lines
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surface treatment
<\/span><\/td>		OSP\u3001Tin spraying, electroless nickel\/gold plating, chemical nickel\/gold, immersion tin, immersion silver
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Microwave production capacity and material properties<\/span><\/div>\r\n<\/div>\r\n\r\n<\/span>\r\n<\/div>\r\n<\/div>\r\n
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<\/span><\/td>		parameters
<\/span><\/td>		Instructions<\/span><\/td><\/tr>
Microstrip Minimum Line Width Line Spacing\uff08mm\uff09
<\/span><\/td>		0.10\/0.10<\/span><\/td>means 0.5oz copper foil<\/span><\/td><\/tr>
Microstrip line width accuracy\uff08mm\uff09<\/span><\/td>0.01mm\uff08supreme\uff09<\/span><\/td>means 0.5oz copper foil<\/span><\/td><\/tr>
Microstrip AB face-to-face bit accuracy
<\/span><\/td>		two-sided\uff1a0.05
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multilayer\uff1a0.10
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Minimum Hole Diameter<\/span><\/td>plate thickness<2.0mm   0.3mm<\/span><\/td>Refers to the finished hole<\/span><\/td><\/tr>
plate thickness\u22652.0mm   6.0mm
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Maximum plate thickness<\/span><\/td>Single and double sided panels   3.2mm
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multilayer    6.0mm<\/span><\/td><\/tr>
Type of microwave boards that can be made
<\/span><\/td>		High-precision single- and double-sided dielectric plates
<\/span><\/td>		Highly reliable metallized holes
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Aluminum Substrate Microwave Board
<\/span><\/td>		Modified, Metallized Grounding
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Copper Substrate Microwave Board
<\/span><\/td>		Multi-cavity, micro-blind grounding
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LCP flexible substrate
<\/span><\/td>		microwave plate
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Low temperature bonded multilayer microstrip boards
<\/span><\/td>		Multi-cavity, multi-step, blind-embedded holes
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High Temperature Melt Multilayer Microstrip Sheet
<\/span><\/td>		Multi-cavity, multi-step, blind-embedded holes
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Microwave Digital Composite Substrates
<\/span><\/td>		PTFE+FR4+PTFE+Ro4003+FR4+Ro4003etc. 4-series\/6-series materials<\/span><\/td><\/tr>
Microwave plate surface plating
<\/span><\/td>		Electroplated thick gold, electroplated nickel\/gold, chemical nickel\/gold, chemical tin, electroplated tin, chemical silver, spray tin,OSP
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Microwave Plate Sheet Types
<\/span><\/td>		PTFE+Ceramic, PTFE+Glass Fiber, Hydrocarbon+Ceramic, PI+Glass Fiber, LCP Flexible Substrate, Foam Substrate
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abroad\uff1aRogers\u3001Taconic\u3001ARLON <\/span><\/p>

Domestic: Taixing Wangling Insulation Material Factory, etc.
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Process Capabilities Printed board technology capabilities sports event parameters clarification Maximum number of layers 36 floors Minimum Line Width\uff08mm\uff09 2.5mil Minimum Line Distance\uff08mm\uff09 2.5mil Minimum weld ring\uff08mm\uff09 via\uff1a0.08 Distance from hole edge to outermost edge of weld ring device hole\uff1a0.18 Minimum Hole Diameter plate thickness <   2.0mm     0.15mm Refers to the finished hole plate […]<\/p>","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"site-sidebar-layout":"no-sidebar","site-content-layout":"page-builder","ast-site-content-layout":"full-width-container","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"disabled","ast-breadcrumbs-content":"","ast-featured-img":"disabled","footer-sml-layout":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-672","page","type-page","status-publish","hentry"],"yoast_head":"\nProcess Capabilities - 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