Plate metal

1. Design specifications and thermal management strategies
Line Layout Principles
Heat path optimization:
High heat generating components (e.g. LED chips, MOSFETs) are laid out directly above the metal base to shorten the heat conduction path.
Example: Design copper foil area ≥ 3 times of the chip size under the LED light bead to reduce thermal resistance.
Electrical isolation:
High-voltage area (such as AC/DC module) insulation thickness ≥ 0.1mm, voltage withstand test needs to pass 3kV/1min.
Over-hole design:
Avoid direct drilling on the metal base (damage to the insulating layer), need to use edge connection or non-penetrating thermal over-hole.
2. Manufacturing process key points
Core process steps
Pre-treatment of metal substrate:
Aluminum substrates need to be chemically cleaned (degreasing, micro-etching) and anodized (to increase surface insulation).
Insulation coating:
Highly thermally conductive adhesive (e.g. Beggs TIF-100) is applied to the metal substrate by screen printing or film pressing.
Circuit layer processing:
High current etching (for thick copper) or graphic plating (for fine circuits) is used.
Cutting and molding:
Aluminum substrates are cut with diamond tools to avoid burrs; copper bases require laser cutting or stamping.
2.Typical application scenarios and design cases
High Power LED Lamp Module
Requirements: Driving current 5A/LED, junction temperature <85℃, life time >30,000 hours.
Design:
Substrate: 2.0mm aluminum substrate (thermal conductivity 2.2 W/m-K).
Circuit: 3 oz copper foil, LED pads 3mm diameter, 10mm pitch.
Heat Dissipation: Thermal Conductive Silicone Grease (0.2mm) laminated on the back + Heat Sink Fins (Surface Area ≥ 50cm²/W).
Electric Vehicle OBC (On-Board Charger)
Requirements: 30kW power, thermal efficiency >90%, vibration resistance.
Design:
Substrate: copper-aluminum composite board (3mm copper layer + 2mm aluminum layer), thermal conductivity 4.5 W/m-K.
Circuit: 6 oz copper foil, copper block (10×10mm) embedded under the MOSFET.
Structure: 4-layer metal base stack, connected to liquid cooling system via heat pipes.